Japan – June 7-9, 2017, 10:00-17:007

Posted 2017 - 05 - 25

Visit Frontline and learn how smart flex solutions for the smart factory are empowering PCB shops to transform complex designs into outstanding products.

Our team will showcase Frontline’s industry-leading PCB pre-production solutions: InCAM®Flex – a high-precision CAM solution for HDI and IC packaging with flex and rigid-flex capabilities, InPlan®Flex – an automatic engineering system for optimal PCB manufacturing workflows with flex and rigid-flex options, InSight PCB® – a web based tool for fast and accurate pre-CAM assessment, and InStack®Design – an automatic tool for designers to plan, design and verify stackups.

To schedule a meeting, please contact Hirohito Dekura. We will be at the Orbotech booth # 6E-12 at Tokyo Big Sight, East Exhibition Hall 4-8, Tokyo, Japan.

The JPCA show is a 3-day industry event showcasing the latest technological offerings of companies involved in the manufacturing of printed circuits and electronic packaging. The show attracted over 40,000 visitors last year and is expected to host over 700 exhibitors this year.