Advanced Modules


InLink is a CAM utility enabling Genesis 2000® and GenFlex® CAM systems users to retrieve CAM-related data from Frontline's Engineering Suite database and store it inside the relevant Genesis®/GenFlex® job data.

Smooth Joints

The Smooth Joints DFM rounds corners in flex PCBs to eliminate sharp angles without compromising the board’s manufacturability, reliability or electrical netlist. It eliminates angular corners and bottlenecks by adding copper and arcs to smooth out the angles. This DFM can also be used to eliminate "kneecaps", the protruding bump that occurs when two lines of differing widths meet at the end points of an angle.

Connect Bundled Lines

Connects two parts of a bus to provide a required connection type (straight, round, or chamfer).

Coverlay Optimization

This DFM action optimizes the coverlay layer by making minor modifications in the copper layer and in the coverlay layer itself. This reduces the amount of manual work required for generating coverlay layers.

Round Bus

Allows you to control bus rounding. Bus rounding may be necessary to solve an angle problem during manufacturing. (A bus is a series parallel lines of any width.)

Tiedown Creation

In flexible circuits, tiedowns are often added to prevent copper peeling. This DFM identifies and generates tiedowns, reducing the amount of manual work required.

Smooth Surfaces

In flex PCBs, angular corners should be avoided. The Smooth Surfaces DFM smoothes these corners by adding or removing copper from the corners without compromising the board’s manufacturability, reliability or electrical netlist.

Gold Tie Bar Creation

Adds tie bar lines from relevant nets to beyond the edge of the board to enable gold plating. Adds test point pads to these tie bar lines, providing access to the tie bars to run electrical tests on them, instead of testing the original gold plated pads.

PCB Numbering

Automatically adds index numbers, in any shape, size or form you choose, that take into account step nesting (arrays) for each PCB in the panel.

Drawing and Dimensioning package

Produce high-quality drawings of layers or features with linear, angular and radial dimensions that automatically appear as you take dimensions. Use customized templates for professional-looking drawings and add your own text - prefixes, suffixes, tolerances and notes. Preview the drawing and print it in full color or export to PDF format.

Create Part Step and Panel

Create the punch or rout tools needed for cutting certain parts (such as stiffeners and partial coverlay areas) from a different material panel before being incorporated into the flex board. Panelize the part step using automatic or interactive panelization, without first manually creating the panel. Quickly and simply create stiffener panels.

Create Partial S&R

Pack S&R subsets from the main panel for die tooling while keeping the original S&R design in tact on all other layers. Efficiently create, maintain and update punch tools, without the need for third-party applications. Simplify tooling hole creation by adding tooling holes with the same S&R as the punch tools.

Rotate any angle panelization

Automatically create panel layouts, based on board profile, with automatic interlocking and any angle board rotation on the board. The best layouts are automatically calculated in seconds with the different options listed according to material utilization percentages, helping you achieve the optimum layout with maximum material usage.

Set Teardrop Attribute

The Set Teardrop Attribute DFMautomatically recognizes teardrops (defined by lines, arcs or surfaces) that were added by the board designer and adds attributes to these features. This DFM ensures that teardrops remain intact should you need to move pad stacks later. In addition, you can automatically replace the original teardrops with teardrops of a different style or size.

Panel Gold Plating

The Panel Gold Plating Analysis tool works on the panel level to analyse whether all gold-plated features defined in the PCB are correctly connected to the gold tiebars in the panel. This analysis ensures that the gold plating process correctly plates all required features in the PCB and marks the instances where the drill or rout cut the gold plating connections on the panel level.

Flex Board Checks

Dedicated to flex boards, the Flex BoardChecks analysis verifies mainly flex-specific features such as bend area, adhesive air-gaps, stiffeners and conductive masks (e.g. silver masks), sharp trace joints and spatial overlap of parallel traces in adjacent layers (I-Beam).

Layer profile Editor

For rigid-flex boards where rigid and flex layers have different boundaries. The Layer Profile Editor creates different layer profiles and combines them to create the board profile. Layer profiles are used for editing: display layer profile/board profile/both, pattern fill, clip area, feature filter, snap and DFM/analysis run in layer or board profiles.

Tooling Hole Analysis

Use Tooling Holes Checks to analyze sets of tooling holes. Ensure that tooling hole sets, on a single panel step or on a repetitive group of steps, are not symmetrical and are not confused with other tooling hole combinations at the production stage.

Rigid-Flex Checks

Run Rigid-Flex Checks to analyze the flex layer part of a rigid-flex board, similar to Flex Board Checks. The following tests are included: bend area, air gap, coverlay, EMI and flex signal part analysis. Also checks the interface axis/area, rigid part connection flex part area, and the distance between the flex part and the rigid part.

Inclusion Checks

A generic analysis action for flex and rigid-flex boards, Inclusion Checks enable you to check the relationship between features from any two layers while allowing you to filter the features to be checked on each layer.