5G and High-Speed Solutions

5G Infrastructure

InPlan

  • Stackups for tighter tolerances and high-speed materials.
  • Supports inlay board including coins and cavity; Signal integrity and loss simulation.
  • Panel design and rotated parts; Loss coupon generator.

InCAM Pro

  • Impedance line recognition, coverage and repair.
  • Line shaping control through wet processes:
    • Advanced etch compensation, Etch compensation checks, and near holes.
    • Hammer head compensation.
    • Parallel spacing optimization.
  • Backdrill creation and checks - Eliminate antenna effects in 5G designs.

Cloud Servers and Data Analysis

InPlan and InCAM Pro

  • Dedicated sets of analysis and cleanup actions for IC substrates.
  • High-speed stackup and signal integrity modelling for high-layer count applications.
  • Fine line shape control for 5/5µm.

5G Smartphones: HDI, SLP and Advanced Flex boards

InPlan

  • Multi-impedance constraints algorithm.
  • High-speed flex and rigid-flex cost-optimized stackups.
  • Panel design, accessory and punch cycles; Automatic multi-zone and buildup creation.

InCAM Pro

  • Flex and rigid-flex analysis.
  • Coverlay layer optimization and tiebar creation.
  • Coverlay tool creation.

Automotive Industry

InPlan

  • Change management and tracking; Comply and verify industry specs.
  • DfR (Design for Reliability) - Avoid delamination caused by resin starvation.
  • Cost-effective stackups.

InCAM Pro

  • Advanced Failure Prevention DfR and optimizers.
  • Enable traceability and revision change tracking.