Minimum System Requirements

Higher resolution for Cu Area and Layer Compare

Supports sub-micron accuracy

Achieve greater accuracy for symbols, coordinates, DFM and angle measurements with no coordinate or symbol rounding during input and output.

• Higher input parameter accuracy in Edit functions, DFMs and analysis
• Higher resolution for raster operations – Layer Compare, Copper Area Calc. – to 0.001 µm
• Lower allowed tolerance for Layer Compare

Advanced Hammerhead Etch Compensation

Advanced Hammerhead Etch Compensation features enable unprecedented precision and customization:

• Define different compensation for inner and outer corners
• Work on copper, rather than on features (pads, traces, surfaces) and consider existing shaves
• Define which type of inner corners to compensate
• Use new compensation shapes – Triangle compensation on both edges and by measurement; oblong and chevron shapes
• Exclude one or more corner angles from compensation
• Define different-sized compensation according to angle
• Define positive or negative offset for ball/square compensation

Frontline InCAM^® Pro for ICS Packaging Tools

Contour to Circuit Conversion

Contour to Circuit Conversion automatically recognizes pads and traces from designs defined as contours and can be used to clean up DXF data (after Outline to Surface) and badly drawn data (after contourizing).

IC Package Feature Classification

IC Package Feature Classification recognizes and assigns attributes to specific parts of IC package jobs in order to treat these features differently during etch compensation and for use in Custom Analysis categories.

• First, convert drawn pads to flashed pads
• Run the Tieline Recognition DFM before this DFM

Tieline Recognition

This DFM automatically recognizes gold tielines on IC substrate boards and marks the tielines with the attribute .tie_line, and optionally with the attribute .n_electric.

Connect Trace to Pad Center

Connect Trace to Pad Center automatically connects traces – that touch the pad or adjacent teardrop – to the pad center. The DFM extends the trace or extends and adds a trace.

Prerequisites: Convert Drawn Pads and Teardrop Recognition.

Signal Layer Checks – Measure Finger Width

Run this dedicated IC packages check to measure rectangle and oval pads on 1/3, ½ and 2/3 of its length. In addition, run Signal Layer Checks to measure spacing, annular ring and line width on copper layers.

Signal Layer Checks – Custom Analysis Categories

Split existing result categories into different categories according to user-defined criteria (feature type, attribute).

Etchback Mask Analysis

Check etchback mask validity against exposed or covered copper and solder mask. Etchback mask is created to clear the parts of the design used inside the layer to connect pads to be gold plated together and is etched away after the gold plating process.

Gold Tiebar Creation

Gold Tiebar Creation automatically adds gold plating tielines to complex BGA packages enabling routing to the opposite side of the board and routing tielines through via holes when there is no space to connect all the gold-plated pads on one side.

Bonding Pads Compensation

Run Bonding Pads Compensation to create additional compensation for oval bonding pads by adding an arc or square surface to the edge of each oval bonding pad on the end(s) of the pad not connected to a trace. The methods ‘Enlarge’ and ‘Enlarge & Reshape’ convert to rectangular pads or surfaces respectively.

Hammerhead Etch Compensation

Add extra compensation to the rectangular corners of pads and surfaces.

Ensure that die bond finger SMDs remain rectangular after the chemical etching process by automatically adding hammerhead shapes to each corner of a die bond finger pad, where spacing allows.

Panel Gold Plating Checks

View reports on gold-plated nets in the PCB (marked by attribute or gold mask) that are not connected to the gold plating bar in the panel.

The fastest CAM we've ever made.

Increase revenues and accelerate time to market
Frontline InCAM Pro for ICS enables faster turnaround for all job types and excels at speeding up automated flows, courtesy of clever algorithms and infrastructure, simultaneous processing, and extended RAM usage. Feel the difference, from the step-up in response time to the satisfying way the software reacts to user input.

The most intuitive user interface we've ever made.

More complex jobs in less time, shorter training
Designed for the change-makers of the future, Frontline InCAM Pro for ICS is astonishingly easy to learn. With its clean design and intuitive feel, Frontline InCAM Pro for ICS enables the fastest and most efficient human-machine interactions with minimum training, helping CAM operators achieve more in less time.

Popup-oriented design
The popup-based interface enables at-a-glance access to multiple functions and multi-tasking on multiple screens, for faster interaction with the system.

Command Line Interface (CLI), auto-completion and keyboard operations

Type commands and use keyboard shortcuts for fast orientation and operation. Choose from built-in commands or create custom ones. The clever auto-completion feature means you only need to input the first few characters.

Easy, efficient and personalized
With an emphasis on customization and ergonomic GUI design, Frontline InCAM Pro for ICS features a bird’s-eye view Layer Matrix for layer management and a Layer List that includes your chosen layers and hides those you’ll need later.

More responsive to evolving needs.

Ready for emerging technologies

Designed to meet growing demand for smaller geometries and smarter electronic devices, Frontline InCAM Pro for ICS integrates support for the industry’s most exciting emerging technologies and trends – 5G, substrate-like circuits, flex and Industry 4.0.

Join the Smart Manufacturing and Industry 4.0 revolution

Frontline InCAM Pro for ICS supports automation and data exchange in manufacturing technologies via advanced traceability and PCB numbering.

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